Overview
Electronic resin is a high-purity linear phenol-formaldehyde resin produced by the condensation reaction of phenol and formaldehyde. It features a narrow molecular weight distribution and low levels of free phenol and impurity ions, both reaching ppm levels. This provides excellent heat resistance and stable mechanical properties for electronic devices. It is recommended for applications in FR-4, CEM copper-clad laminates, insulation materials, and other composite materials. Low-molecular-weight linear phenol-formaldehyde resins can also be used as intermediates for specialty epoxy resins.
General properties
High Purity
High Heat Resistance
High Electrical Insulation
Technical Data:
|
Model |
Y1001 |
|
Appearance |
Light yellow liquid |
|
Viscosity（mPa·s/25℃） |
1000-1300 |
|
Solid content（%/150℃/1h） |
65-70 |
|
Free phenol (%) |
<0.5 |
|
Softening Point（℃） |
95-105 |
|
Solvent |
Butanone |
Applications:
The products are used in chip process adhesives, photoresists, semiconductor packaging molding compounds, copper clad laminates, prepregs, PCB inks, epoxy powder coatings, electronic encapsulation materials, potting compounds, conductive silver pastes and other fields, and are ultimately used in smart cars, mobile phones, notebooks, computers, white appliances, Internet terminals and Internet servers, signal base stations and other aspects. They are the physical foundation for the modern electronic information industry.
Package:
Paper-plastic composite packaging lined with PP bags, 25kg/bag.
Transportation:
This product is packed in galvanized iron drum, net weight: 200KG/drum
Storage:
Store in a dry, cool, and well-ventilated place. Be careful not to break the barrel. If damaged, use immediately. Store below 15°C for 12 months.
Overview Phenolic Resin 2402 is a pure phenolic resin synthesized by the condensation polymerization of tert-butylphenol and formaldehyde in an acidic medium. It is oil-soluble and readily blended with various synthetic rubbers.
Overview Electronic resin is a high-purity linear phenol-formaldehyde resin produced by the condensation reaction of phenol and formaldehyde. It features a narrow molecular weight distribution and low levels of free phenol and impurity ions, both reaching ppm levels. This provides excellent heat resistance and stable mechanical properties for electronic devices. It is recommended for applications in FR-4, CEM copper-clad laminates, insulation materials, and other composite materials. Low-molecular-weight linear phenol-formaldehyde resins can also be used as intermediates for specialty epoxy resins.
Overview Phenolic resin is a thermoplastic resin commonly used in insulating laminates. Its excellent electrical insulation properties, chemical stability, and high-temperature resistance make it a popular choice for insulating laminates in electrical equipment, circuit boards, and other applications. Phenolic resin is typically combined with fiber materials (such as fiberglass cloth and paper) and processed through heat and high pressure to create a robust insulating laminate or component.
Overview Phenolic resin offers excellent thermal insulation properties, is self-melting and self-repairing, and effectively blocks the penetration of moisture, water, and external irritants. Its stable cross-sectional dimensions and excellent thermal insulation properties minimize building losses, significantly reducing energy consumption and effectively conserving indoor heat. It is environmentally friendly, contains no harmful substances, is non-toxic and odorless, and effectively maintains indoor temperature and humidity balance, ensuring favorable airflow, acoustic, and thermal conditions, creating comfortable, safe, and healthy living spaces.
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