Overview
Phenolic Resin 2402 is a pure phenolic resin synthesized by the condensation polymerization of tert-butylphenol and formaldehyde in an acidic medium. It is oil-soluble and readily blended with various synthetic rubbers.
General properties
Other Names: Pure Phenolic Resin, 100% Oil-Soluble Phenolic Resin，Para Tertiary Butylphenol Formaldehyde Resin
Molecular Formula: (C₁₁₁₄H₁₄O)₄
Technical Data:
|
Item |
Index |
|
Appearance |
Light yellow flake solid |
|
Specific Gravity |
1.08-1.12 g/cm3 |
|
Softening Point |
90-115℃ |
|
Methylol Content |
8-12% |
|
Free phenol |
≤1.0% |
|
Heating Loss |
≤0.5% |
Applications:
1. It has good compatibility with chloroprene adhesives and can be used in the production of chloroprene rubber adhesives, particularly for shoe adhesives.
2. It can be used as a curing agent for butyl rubber, natural rubber, styrene-butadiene rubber (SBR), and other rubbers, and is particularly suitable for the vulcanization of butyl rubber.
3. In the coatings industry, it can be used in the production of exterior topcoats, floor paints, marine coatings, anti-rust paints, and water-based inks. It can also be used as a raw material for thin film anti-rust oils.
Package:
Paper-plastic composite packaging lined with PP bags, 25kg/bag.
Transportation:
Not classified as a hazardous material according to transportation regulations.
Storage:
Store indoors in a dry, well-ventilated area, protected from heat and ignition. Recommended storage period: 12 months.
Overview Phenolic Resin 2402 is a pure phenolic resin synthesized by the condensation polymerization of tert-butylphenol and formaldehyde in an acidic medium. It is oil-soluble and readily blended with various synthetic rubbers.
Overview Electronic resin is a high-purity linear phenol-formaldehyde resin produced by the condensation reaction of phenol and formaldehyde. It features a narrow molecular weight distribution and low levels of free phenol and impurity ions, both reaching ppm levels. This provides excellent heat resistance and stable mechanical properties for electronic devices. It is recommended for applications in FR-4, CEM copper-clad laminates, insulation materials, and other composite materials. Low-molecular-weight linear phenol-formaldehyde resins can also be used as intermediates for specialty epoxy resins.
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